Wafer icing is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a machine called a Dicing Saw) or by laser cutting. Following the dicing process the individual silicon chips are encapsulated into I.C. Packages which are then suitable for use in building electronic devices such as computers, etc.